Akasa Thermal Solution

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	Thermal gap filler Akasa thermal gap filler is a thermally conductive interface pad which is versatile and suitable for use between components and their heat sinks. Two sizes: 1.5 and 5mm thickness product code: AK-TT300-01 / AK-TT300-02 TIM Kit 5g syringe of high performance thermal compound AK-455 complete with a spreader card and 125ml of TIM Clean fluid for professional chipset preparation. Must have accessory for every PC enthusiast. product code: AK-MX004 ProGrade+ 5022 Get more from your cooler. AMD recommended Pro-grade+ 5022 provides ultimate thermal performance even at low pressures. 3.5g with spreader card. product code: AK-TC5022 ProGrade 460 Get more from your cooler. Pro-grade 460 Silicone-technology, evolutionary thermal compound for outstanding thermal performance. 3.5g with spreader card. product code: AK-460 Performance Compound 455 Get more from your cooler. New improved formula 455 delivers high thermal performance; even at low pressures. 5g with spreader card. product code: AK-455-5G Silver Compound 450 High performance silver based thermal compound with high thermal conductivity, 5g syringe complete with spreader card. product code: AK-450-5G Tim-Clean Thermal Interface Cleaner, fluid for all thermal interfaces. Citrus based solvent safe to use. Perfect for cleaning CPU, GPU or base heatsink. product code: AK-TC Thermal Adhesive Tape Double-sided adhesive tape, excellent thermal conductivity, 80x80mm, micro-fibreglass reinforced. product code: AK-TT12-80